Advanced 355nm UV Laser System for PCB Depaneling

1 / 5

Advanced 355nm UV Laser System for PCB Depaneling

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

Send Inquiry

Product Description

Basic Specifications

Model NO.

UVC-01

Application

Automotive Industry, PCB

Cooling System

Water Cooling

Technical Class

Pulse Laser

Applicable Material

Metal

Laser Type

UV Laser

Wavelength

355 Nm

Output Power

15/20 Watts

Min Beam Diameter

<10um

Repetition Accuracy

3 μM

Dimensions

1060mm X 1000mm X 1850mm

Origin

China

Product Description

355nm UV Laser Cutting Machine

Laser depaneling machine designed for the PCB and related industries. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products.

Self-developed control software enables multi-panel cutting, auto-focusing, and shrinkage compensation for precision. The high-precision motion, scanning galvanometer, and CCD positioning system ensure industry-leading accuracy.

The UV laser operates at a 355 nm wavelength with a "cold marking" method. The laser beam diameter is focused to only 20 μm, ensuring no significant thermal influence next to the slit and preventing heat damage to electronic components.

Technical Specification

Parameter	Specification
Laser Type	UV Laser (355nm)
Beam Diameter	< 10µm
Pulse Frequency	10 – 200 kHz
Laser Power	15W / 20W
Cutting Thickness	0.004" – 0.07"
Repeat Accuracy	3μm
Marking Field Size	50mm × 50mm
X-Y Travel Distance	400mm × 300mm
Cooling System	Water-cooled
Laser Safety Class	Class I (FDA/CDRH compliant)

Key Features

Cold ProcessingMinimizes heat-affected zone (HAZ) to protect sensitive components.

Non-Contact CuttingZero mechanical stress prevents deforming or warping PCBs.

High Precision3μm repeatability with auto-focus and shrinkage compensation.

Material VersatilityCompatible with FR4, FR5, CEM, Polyimide (PI), PTFE, and Ceramics.

Burr-Free EdgesClean cuts without debris, micro-dust, or micro-cracks.

SMEMA CompatibleFull integration with automated assembly line processes.

Packing & Delivery

We provide air-freight, sea-freight, and express services. Our machines are securely packed in customized wooden boxes to ensure safe international transit.

Industry Expertise

Frequently Asked Questions

What wavelength does the UV laser use, and why is it ideal for PCB depaneling?

The machine employs a 355nm UV laser, which provides "cold processing" with minimal thermal impact. The focused beam diameter of 20µm ensures micron-level precision without damaging adjacent components or materials.

What materials can this system cut?

It supports a wide range of materials including Flexible/Rigid PCBs (FR4, FR5, CEM, polyimide, PTFE), non-conductive layers (Coverlay, CVL, ceramics, glass), and metals like aluminum or copper for marking.

What is the maximum cutting thickness?

The machine can efficiently cut materials from 0.004" (0.1mm) up to 0.07" (1.78mm), which can be adjusted via software for optimal results.

How does "Cold Processing" benefit electronic assemblies?

Unlike CO2 or Fiber lasers, the 355nm UV laser breaks molecular bonds rather than melting material. This prevents carbonization and heat damage to sensitive nearby ICs or connectors.

Is the machine compatible with automated production lines?

Yes, the system is fully SMEMA compatible, allowing it to integrate seamlessly into automated PCB assembly and handling lines.

What level of precision can be expected?

The system achieves a repeat accuracy of 3μm, supported by a CCD positioning system and self-developed software for shrinkage compensation.