Small-Format High-Speed Microhole Machining System

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Small-Format High-Speed Microhole Machining System

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

Basic Information

Model NO.

AT-61168

Origin

China

Package Size

150.00cm * 90.00cm * 150.00cm

Gross Weight

2000.000kg

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Product Description

The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.

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Product Features

Utilizes high-power, high-stability ultraviolet laser for direct ablation, resulting in a μm-level heat-affected zone and a minimum spot size of 5 μm.
Precise galvanometer control of beam deflection for high-speed etching on small formats.
Electrically adjustable Z-axis to accommodate varying material thicknesses and 3D etching structures.
High-resolution side-axis industrial camera for high-precision focusing and repeatability.
Robust marble table top to ensure overall structural stability and long-term precision.
Multi-material capability: processes metals, ceramics, organics, glass for etching, drilling, and cutting.
Minimum processing line width of 5 μm with a standard range of 50*50 mm.

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Product Applications

Electronics Manufacturing: Semiconductor flexible circuit board cutting, ITO film etching, microelectronic device manufacturing.
Medical Industry: Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (pore sizes 1-30 μm).
Precision Machinery: Precision micro-mold forming, micro-nozzle processing, microhole filtration components.
New Energy: Lithium battery separator microhole processing (pore size ≤ 3 μm), hydrogen fuel cell bipolar plate processing.
Scientific Research: Microstructure research, material science experiments, micro-nano manufacturing development.
Other Applications: Carbon fiber micro-cutting, PI micro-masking, silicone microneedle molds, precision etching.

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Product Parameters

Category	Parameter	Specifications (FM-UV3)
Laser	Wavelength	355 nm
Laser	Power	> 3W @ 40 kHz (3-40W optional)
Laser	Modulation Frequency	1-200 kHz
Laser	Beam Quality M²	< 1.3
Galvanometer	Scan Range	< 50*50 mm
Galvanometer	Repeatability	< 1 μm
Z-Axis	Travel / Repeatability	200 mm / ≤ ±3 μm
Processing	Minimum Pore Size	5 μm
Processing	Processing Thickness	≤ 0.5 mm
Processing	Max Depth-to-Width Ratio	> 10:1
System	Cooling Method	Water-cooled
Dimensions	Machine Size	750 * 1100 * 1700 mm

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Service Scope

Technical services, technology development, and consulting in specialized fields including computer software and hardware, optical instruments, and semiconductor device equipment. Professional supply of CNC machine tools, electronic components, electromechanical equipment, and metal cutting/welding solutions. Expertise in functional glass, optical materials, and photovoltaic equipment.

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