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The MPS-D series laser cutting machine is a high-configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. It integrates imported servo drives and customized systems to meet the most demanding industrial needs.
Core Equipment Portfolio:
Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si/SiC/Lt/Ln Wafers), Laser Annealing Machines, Automatic Dicing Saw Machines, and Automatic Silicone Dispensing Equipment.