Game-Changing 4-Head Laser Drilling Equipment: Revolutionary Simultaneous Processing for Next-Generation Electronics Manufacturing - Unmatched Speed & Precision

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Product Description

⚙️ Basic Information
StructureLaser Drilling Machine
LayoutVertical
Number of ShaftMulti-Axis
Hole Diameter<50mm
Automatic GradeAutomatic
PrecisionHigh Precision
CertificationCE, RoHS, ISO 9001
Number of Heads4 Heads
Efficiency Boost300% Higher Output
Capacity100 sets/Month
🚀 Product Description
Game-Changing 4-Head Laser Drilling Equipment: Revolutionary Simultaneous Processing for Next-Generation Electronics Manufacturing
Laser Drilling Equipment
Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards.
⭐ Highlights
Product Highlights
💎 Unmatched Efficiency
1. Four heads operate simultaneously, delivering 4x higher production capacity.
2. Supports roll-to-roll, roll-to-sheet automation.
3. Dramatically reduces production cycle times.
🎯 Precision Engineering
1. High-precision linear motor system with integrated CCD.
2. ±0.02mm accuracy guarantee for superior quality.
3. Professional laser source & galvanometer technology.
🛠️ Process Optimization
1. Eliminates traditional plasma treatment requirements.
2. Enables direct copper plating.
3. Reduces production steps and associated costs.
🌐 Versatile Applications
1. High-density PCB & FPC manufacturing.
2. Lithium battery separator drilling.
3. Semiconductor wafer processing.
📊 Specifications
Laser TypeNanosecond UV, Picosecond UV, Picosecond Green Laser
Processing Area550mm × 1500mm (Customized)
Machine Size7200mm × 2300mm × 2250mm
Processing Accuracy±0.02mm
Electric PowerMain Unit + 30kW Chiller + 7kW Exhaust Fan
Machine Weight8000 KG
EnvironmentTemp: 22℃±2, Humidity: 40% - 60%
Processing Quality
Precision & Quality Assurance
Efficiency Chart
Efficiency Comparison
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🏢 Research & Development
Specializing in the independent research and development of laser generators, optical devices, and automation systems. We provide innovative solutions for laser micromachining including PCB, semiconductors, and new energy batteries.
R&D Team Lab Work Technology
Mechanical Design Center
Laser R&D Center
R&D Laboratory
📦 Packing & Delivery
Packaging
Packing: 1PCS/Wooden Case
Shipping: By sea or by express. Due to weight, sea freight is recommended.
Standard Delivery: 30-45 days after confirmation.
Custom Delivery: 45-90 days after confirmation.
🤝 Our Clients
Clients Logos
❓ Frequently Asked Questions
What is the advantage of 4-head synchronous drilling?
Our 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time.
What is the processing accuracy?
The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes at high speeds.
What materials can it process?
It is compatible with FR4, rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.
Does it support blind vias and buried vias?
Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.
Is the system automated?
Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.
Is beam quality consistent across all four heads?
Our beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality across the entire processing area.

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