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Home > Industrial Ceramic Processing Equipment > High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
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High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing
High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing

High Performance 4 Head Laser Drilling Equipment for FPC/PCB Roll-to-Roll Automatic Processing

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Product Description

High-Efficiency Automatic 4-Head Roll-to-Roll Laser Drilling Machine

Revolutionizing FPC & HDI PCB Electronics Manufacturing with Industry-First 4-Head Synchronous Technology.

High Performance 4 Head Laser Drilling Equipment
⚙️ Basic Information
StructureLaser Drilling Machine
LayoutVertical
Controlling ModeAutomatic
Number of ShaftMulti-Axis
Hole Diameter<50mm
PrecisionHigh Precision (±0.02mm)
CertificationCE, RoHS, ISO 9001
Laser Heads4 Heads (Synchronous/Independent)
Efficiency Boost300% Higher Output Than Single-Head
Processing MaterialsCopper Clad Laminate, Fr4, Polyimide, Glass Epoxy, Ceramic
🚀 Product Highlights
⚡4-Head Synchronous Processing

Massive 4X Efficiency Boost. Dramatically increase output and meet tight deadlines for large orders with parallel processing power.

💎Picosecond UV Laser Source

Superior Hole Quality: No burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide and glass substrates.

♻️Plasma-Free Process

Laser parameters are fine-tuned to eliminate post-drilling plasma treatment, reducing steps and consumable costs.

Process Highlight 1
Process Highlight 2
Process Highlight 3
📋 Technical Specifications
Laser TypeNanosecond UV, Picosecond UV, Picosecond Green Laser
Processing Area550mm × 1500mm (Customized available)
Machine Size7200mm × 2300mm × 2250mm
Processing Accuracy±0.02mm
Machine Weight8000KG
Power LoadingMain Unit +30kW Chiller +7kW Exhaust Fan +11kW
EnvironmentHumidity: 40% - 60%; Temp: 22℃±2
Precision Results
Quality Assurance
🔍 Application Areas
PCB Industry

• HDI PCBs, Multi-layer Boards
• High-speed through-hole & blind via drilling

Flexible Circuits

• FPC, Flex-Rigid Boards
• Polyimide cutting & drilling

Semiconductors

• IC Substrates, Lead Frames
• Ultra-fine micro-vias (≤0.05mm)

🏢 R&D and Production Capability

Specializing in the independent research and development of laser generators, optical devices, and automated system integration. We provide innovative solutions for laser micromachining across industries such as printed circuit boards, consumer electronics, and semiconductors.

R&D Team 1
R&D Team 2
R&D Team 3
📦 Packing & Delivery
📦
Packing: 1 Set / Wooden Case
Weight: Gross Weight approx. 8400kg
Shipping: Recommended by Sea due to weight. International Express available for urgent parts.
Time: Standard goods: 30-45 days; Customized goods: 45-90 days.
Packing and Shipping
❓ Frequently Asked Questions
Q1: What is the main advantage of the 4-head synchronous laser drilling machine?
A: The 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time and operational costs.
Q2: What is the processing accuracy of the system?
A: The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes even at high speeds.
Q3: Which materials can be processed with this machine?
A: It is fully compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, battery separators, and copper clad laminates.
Q4: Does the machine support blind and buried via drilling?
A: Yes, it handles blind via drilling (BVB), buried vias, and through-holes with a minimal Heat Affected Zone (HAZ) for clean and high-quality sidewalls.
Q5: Is the drilling process fully automated?
A: Yes, it features CCD Vision Alignment and automated loading/unloading systems with real-time distortion correction for high-precision flexible board processing.
Q6: How do you ensure consistent beam quality across all four heads?
A: Our advanced beam splitting and optical control technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality across the entire processing area.

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