Market-Leading 4-Head Roll-to-Roll Laser Drilling System: Redefining High-Volume Production Standards with 4X Efficiency Gain for PCB&FPC

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Market-Leading 4-Head Roll-to-Roll Laser Drilling System: Redefining High-Volume Production Standards with 4X Efficiency Gain for PCB&FPC

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Product Description

Market-Leading 4-Head Roll-to-Roll Laser Drilling System: Redefining High-Volume Production Standards with 4x Efficiency Gain For PCB & FPC

Basic Information

Structure:Laser Drilling Machine

Layout:Vertical

Controlling Mode:Artificial

Number of Shaft:Multi-Axis

Hole Diameter:<50mm

Automatic Grade:Automatic

Precision:High Precision

Laser Type:Nanosecond/Picosecond UV & Green

Efficiency Boost:300% Higher Than Single-Head

Laser Heads:4 Heads (Synchronous/Independent)

Product Description

Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.

Highlights & Features

★ Unmatched Efficiency

1. Four heads operate simultaneously, delivering 4x higher production capacity
2. Supports roll-to-roll, roll-to-sheet, and sheet-to-sheet automation
3. Dramatically reduces production cycle times.

★ Precision Engineering

1. High-precision linear motor system with integrated CCD ensures seamless splicing
2. ±0.02mm accuracy guarantee for superior product quality
3. Professional galvanometer & F-theta lens technology.

★ Process Optimization

1. Enables direct copper plating by eliminating traditional plasma treatment
2. Reduces production steps and associated costs
3. Improves overall manufacturing yield rates.

★ Versatile Applications

1. High-density PCB & Flexible circuit board (FPC) manufacturing
2. Lithium battery separator drilling
3. Semiconductor wafer processing and Automotive electronics.

Technical Specification

Laser Type	Nanosecond UV, Picosecond UV, Picosecond Green Laser
Processing Area	550mm × 1500mm (customized)
Machine Size	7200mm × 2300mm × 2250mm
Accuracy	±0.02mm
Weight	8000KG
Power Loading	Main Unit + 30kW Chiller + Exhaust Fan
Environment	Temperature: 22℃±2; Humidity: 40% - 60%

Precision & Quality Showcase

Microscopic Accuracy on PCB Samples

4x Production Capacity Comparison

Our Four-Head Laser Drilling Machine delivers exceptional precision with microscopic accuracy. Each hole is perfectly round and uniform, showcasing the machine's ability to maintain consistent quality across high-volume production runs.

Expertise & Innovation

Founded in 2013, we are a technology-oriented enterprise specializing in the independent research and development of laser generators, optical devices, and automation systems. We provide innovative solutions for laser micromachining applications, creating value in industries such as semiconductors, glass, new energy, and solar energy.

Packing & Delivery

Packing:1PCS / Wooden Case

Delivery Time:30-45 Days (Standard); 45-90 Days (Customized)

Shipping:Sea Freight (Recommended) or International Express

Our Global Clients

Frequently Asked Questions

Q1: What is the main advantage of the 4-head synchronous drilling technology?

It enables parallel processing, which quadruples your throughput for HDI PCBs and Flexible Circuits while significantly reducing production cycle times.

Q2: What level of drilling accuracy can be expected?

The system offers a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring high-speed precision for micro-vias and blind holes.

Q3: Which materials are compatible with this laser system?

The equipment is designed to process rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.

Q4: Does the machine support complex via types like blind and buried vias?

Yes, it efficiently handles blind via drilling (BVB), buried vias, and through-holes with a minimal Heat Affected Zone (HAZ).

Q5: How is material alignment handled for flexible boards?

It features advanced CCD Vision Alignment and automated loading with real-time distortion correction specifically for flexible board processing.

Q6: What kind of after-sales support do you offer?

We provide comprehensive warranties, online technical training, installation assistance, and a stable supply of spare parts for 24/7 operation.