Advanced Quartz Loading System for Optimal Material Diffusion

Customization: Available
After-sales Service: Provide
Warranty: 12 Months

Product Description

Basic Information
Product Name
Quartz Boat Loading and Unloading Machine
Feature
Intelligent Photovoltaic Transmission Automation
Certification
ISO
Condition
New
Package
Customized or Wooden Box
Origin
China
Product Description
Texturing and Etching Machine
G Texturing And Etching Automatic Machine
  • Usage: Automatic loading of stacked silicon wafers for texturing process.
  • Capacity: ≥ 9600 - 14000 pcs/h
  • Fragment Rate: ≤ 0.02%
  • Power On Rate: ≥ 99%
Chain Oxidation Equipment
Chain Oxidation Automation Equipment
  • Usage: Automatic feeding for chain oxidation process.
  • Capacity: ≥ 9500 pcs/h
  • Fragment Rate: ≤ 0.01%
  • Power On Rate: ≥ 99%
PVD Automatic Machine
PVD Automatic Wafer Loading Machine
  • Usage: Automatic chip loading and unloading for PVD process of hit battery.
  • Capacity: ≥ 4000 pcs/h
  • Fragment Rate: ≤ 0.05%
  • Power On Rate: ≥ 99%
PECVD Loading Machine
SSX PECVD Automatic Loading Machine
  • Usage: Automatic loading and unloading sheet for tubular PECVD graphite boat.
  • Capacity: ≥ 5400 pcs/h
  • Fragment Rate: ≤ 0.04%
  • Power On Rate: ≥ 99%
Quartz Boat Machine
Quartz Boat Loading and Unloading Machine
  • Usage: Automatic loading and unloading of quartz boat for diffusion and annealing process.
  • Capacity: ≥ 9600 pcs/h
  • Fragment Rate: 0.03%
  • Power On Rate: ≥ 99%
ALD Equipment
Efficient PERC Battery ALD Equipment
  • Usage: Automatic chip loading and unloading for ALD process.
  • Capacity: ≥ 7500 pcs/h
  • Fragment Rate: ≤ 0.02%
  • Power On Rate: ≥ 99%
Industrial Application
Machine Applications
Exhibition & Customers
We are mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, with over 200 customers and suppliers. Our main product line includes Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, and Automatic Silicone Dispensing Equipment.
Packaging & Shipping
Packaging details
Frequently Asked Questions
How to choose a suitable machine?
You can share the working piece material, size, and the required machine functions. We will recommend the most suitable machine based on our extensive industry experience.
What is the warranty period for the equipment?
We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.
Do you provide customized solutions for specific production lines?
Yes, our equipment can be customized to fit your specific capacity requirements and process flow, including adjustments for wafer size and transmission speed.
What is the typical lead time for an order?
Lead time varies depending on the machine specification and customization requirements, generally ranging from 4 to 8 weeks for standard models.
How is the equipment packaged for international shipping?
All machines are packed in standard export wooden boxes or customized protective packaging to prevent damage during sea or air freight.
Can you provide on-site installation and training?
Yes, we offer technical guidance for installation and can arrange for engineers to provide operational training for your staff as needed.

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