Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

Customization: Available
After-sales Service: Provided
Warranty: 12 Months

Product Description

Basic Information

Model NO.
GLC-01
Application
Home Appliance, Environmental Equipment, Automotive Industry
Cooling System
Air Cooling
Technical Class
Continuous Wave Laser
Applicable Material
Metal, Brittle Materials
Structure Type
Gantry Type
Laser Source
532nm Green Laser, 30W
Motion System
Linear Motors (X/Y: 200mm) + Ball Screw Z
Processing Area
150×150mm
Cutting Precision
±0.05mm
Dimensions
1410 × 1350 × 2070mm
Weight
1090kg

Product Description

Green Laser Cutting System View 1
Green Laser Cutting System View 2
Our Precision Green Laser Cutting System represents the forefront of laser processing technology for brittle and heat-sensitive materials. Utilizing a specialized 532nm wavelength laser source, this machine delivers exceptional cutting precision with minimal thermal impact, making it ideal for high-value manufacturing applications in electronics, medical devices, and advanced materials processing.

Technical Parameters

Parameter Specification
ModelGreen Laser Cutting Machine (GLC-01)
Laser TypeGreen Laser (532nm)
Laser Power30W
Cutting Precision±0.05mm
Cutting Width<0.15mm
Processing Area150×150mm (Customizable)
Control ModeAutomatic
File FormatDXF
Cooling MethodWater-cooled
Power Supply220V/50Hz

Applications

Application Samples
Industry Application Details
ElectronicsPCB cutting, semiconductor processing
Medical DevicesPrecision component manufacturing
Advanced MaterialsCeramic drilling, diamond cutting
R&DMaterial processing experiments
Precision MfgGlass perforation, brittle material processing

Core Technical Configuration

Component Specification
Machine StructureIntegrated Sheet Metal Cabinet + Marble Platform
Motion SystemLinear Motors (X/Y-axis: 200mm) + Ball Screw Z-axis (100mm)
Vision SystemCustom CCD Monitoring System
Control SystemKY-URCutting Motion Control Software
Industrial PCYanhua Industrial Computer
Fume ExtractionCustom Smoke Extraction System
Detailed Machine Photo

Performance Characteristics

Cutting Performance

  • Materials: Brittle materials, high-hardness metals, thermal-sensitive substrates
  • Cutting Quality: Smooth edges, burr-free, minimal heat-affected zone
  • Positioning Accuracy: High-precision motion control system

Operational Features

  • Stability: Marble base for vibration-free operation
  • Safety: Fully enclosed protective cabinet
  • Flexibility: Rotatable processing platform
Performance View 1
Performance View 2

Frequently Asked Questions

Q1: What are the main advantages of a 532nm green laser? A1: The 532nm wavelength provides a smaller focal spot and higher absorption rates for many materials, resulting in higher precision and a significantly smaller heat-affected zone compared to infrared lasers.
Q2: Can the processing area be customized? A2: Yes, while the standard processing area is 150x150mm, we offer customization options to meet specific industrial requirements.
Q3: What materials are best suited for this system? A3: It is specifically designed for brittle materials (like glass and ceramics), high-hardness metals, and heat-sensitive substrates used in the semiconductor and medical industries.
Q4: Does the system include a vision monitoring system? A4: Yes, the GLC-01 comes equipped with a custom CCD monitoring system for real-time processing oversight and high-precision alignment.
Q5: What file formats are compatible with the control software? A5: The KY-URCutting motion control software primarily supports DXF file formats, which are standard in industrial design.
Q6: Is a clean room environment necessary for installation? A6: While not strictly required for all applications, a clean room environment is highly recommended to maintain the precision optics and ensure consistent high-quality output.

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