Basic Information
| Model NO. |
SSX |
| Product Name |
Loading and Unloading machine |
| Feature |
Loading and Unloading |
| Certification |
ISO |
| Condition |
New |
| Transport Package |
Customized or Wooden Box Packaging |
| Specification |
Standard Specifications |
| Origin |
China |
Product Description
G Texturing And Etching Automatic Machine
- Usage: Automatic loading of stacked silicon wafers
- Capacity (2 channels): ≥ 9600 - 14000 pcs/h
- Fragment Rate: ≤ 0.02%
- Power On Rate: ≥ 99%
Chain Oxidation Automation Equipment
- Usage: Automatic feeding for chain oxidation process
- Capacity: ≥ 9500 pcs/h
- Fragment Rate: ≤ 0.01%
- Power On Rate: ≥ 99%
PVD Automatic Wafer Loading Machine
- Usage: Automatic chip loading/unloading for PVD process
- Capacity: ≥ 4000 pcs/h
- Fragment Rate: ≤ 0.05%
- Power On Rate: ≥ 99%
SSX PECVD Automatic Loading Machine
- Usage: Loading/unloading for tubular PECVD graphite boat
- Capacity: ≥ 5400 pcs/h
- Fragment Rate: ≤ 0.04%
- Power On Rate: ≥ 99%
Quartz Boat Loading & Unloading Machine
- Usage: Automatic handling for diffusion and annealing
- Capacity: ≥ 9600 pcs/h
- Fragment Rate: 0.03%
- Power On Rate: ≥ 99%
Efficient PERC Battery ALD Equipment
- Usage: Automatic chip loading and unloading for ALD
- Capacity: ≥ 7500 pcs/h
- Fragment Rate: ≤ 0.02%
- Power On Rate: ≥ 99%
Application
Exhibition & Customers
Established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products.
Main products include: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machine, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine, and Automatic Silicone Dispensing Equipment.
Packaging & Shipping
Frequently Asked Questions
Q1: How to choose a suitable machine?
A: You can provide details about your working piece material, size, and the required machine functions. We will recommend the most suitable solution based on our extensive industry experience.
Q2: What is the warranty period for the equipment?
A: We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains efficient.
Q3: Can the equipment be customized for specific production lines?
A: Yes, we offer standard specifications as well as customized options for transport packaging and machine functions to fit your specific process needs.
Q4: What is the typical fragment rate for your loading machines?
A: Our machines are designed for high precision, with fragment rates typically ranging from ≤ 0.01% to ≤ 0.05% depending on the specific model.
Q5: What kind of packaging is used for international shipping?
A: We use professional customized wooden box packaging to ensure the safety of the equipment during long-distance international transport.
Q6: Do you provide support for power-on rates and efficiency?
A: Yes, our equipment maintains a power-on rate of ≥ 99%, and we offer technical guidance to help you reach maximum production capacity.
CXO Laser
