All-in-One Four-Head Laser Drilling System: Efficiency, Precision, & Automation for High-End Manufacturing

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Product Description

Basic Information

Structure
Laser Drilling Machine
Layout
Vertical
Controlling Mode
Artificial
Number of Shaft
Multi-Axis
Hole Diameter
<50mm
Automatic Grade
Automatic
Precision
High Precision
Condition
New
Laser Heads
4 Heads (Synchronous/Independent)
Key Innovation
Industry-First 4-Head Synchronous Technology
Efficiency Boost
300% Higher Output Than Single-Head
Processing Materials
Copper Clad Laminate, Fr4, Polyimide, Glass Epoxy

Product Description

All-in-One Four-Head Laser Drilling System: Efficiency, Precision, & Automation for High-End Manufacturing

Laser Drilling System

Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.

Core Highlights

4-Head Synchronous Processing: Massive 4X Efficiency Boost dramatically increases output and meets tight deadlines for large orders.
Optimized Process (Plasma-Free): Laser parameters are fine-tuned to eliminate the need for post-drilling plasma treatment, reducing process steps.
Picosecond UV Laser Source: Superior hole quality with no burrs, cracks, or thermal damage. Perfect for delicate materials.

Precision & Quality Assurance

Our Four-Head Laser Drilling Machine delivers exceptional precision with microscopic accuracy. The image above demonstrates the quality of drilling results on various materials including PCB, battery separator, and flexible circuit samples. Each hole is perfectly round and uniform, showcasing the machine's ability to maintain consistent quality across high-volume production runs.

Efficiency Comparison Chart

The chart clearly illustrates the dramatic efficiency gains achieved with our Four-Head system compared to traditional single-head equipment. Customers experience a significant reduction in production time and improved return on investment.

Technical Specifications

Product NameAll-in-One Four-Head Laser Drilling System
Laser TypeNanosecond UV, Picosecond UV, Picosecond green laser
Processing Area550mm×1500mm (customized)
Machine Size7200mm×2300mm×2250mm
Processing Accuracy±0.02mm
Electric Power LoadingMain Unit +30kW Chiller +7kW Exhaust Fan +11kW
Machine Weight8000KG
Environment RequirementsHumidity: 40% - 60% no condensation; Temperature: 22℃±2

Company Capabilities

Company Facility

Founded in 2013, we are a technology-oriented enterprise specializing in the independent research and development of laser generators, optical devices, equipment application processes, and automation system integration. We provide innovative solutions for laser micromachining in industries such as printed circuit boards, consumer electronics, semiconductors, glass, new energy power batteries, and solar energy.

Application Areas

Application Fields
PCB Industry: HDI PCBs, Multi-layer Boards, High-speed through-hole & blind via drilling.
Flexible Circuits: FPC, Flex-Rigid Boards, Polyimide cutting & drilling.
Semiconductor: IC Substrates, Lead Frames, Ultra-fine micro-vias (≤0.05mm).
Consumer Electronics: Smartphones, Wearables, Mass production solutions.

Packing & Delivery

Packing and Shipping
  • Packing: 1PCS/Wooden Case
  • Shipping: By sea or by express. Due to weight, sea freight is recommended for standard orders.
  • Standard Goods: 30-45 days after order confirmation and deposit.
  • Customized Goods: 45-90 days after order confirmation and deposit.

Frequently Asked Questions

What is the main advantage of the 4-head synchronous laser drilling machine?
The 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits while significantly reducing production cycle times.
What level of accuracy does the system provide?
The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes even at high speeds.
Which materials are compatible with this equipment?
It is fully compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.
Does the machine support complex via types like blind and buried vias?
Yes, it handles blind via drilling (BVB), buried vias, and through-holes with a minimal Heat Affected Zone (HAZ) for clean, high-quality sidewalls.
Is the drilling process automated?
Absolutely. It features CCD Vision Alignment and automated loading with real-time distortion correction, making it ideal for flexible board processing.
Is the beam quality consistent across all four heads?
Yes, our advanced beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality across the entire processing area.

Our Clients

Client Portfolio

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