Advanced 4-Head Laser Drilling System: Cutting-Edge Technology for High-Speed PCB, Flexible Circuits & Lithium Battery Applications

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Product Description

Basic Information
Structure
Laser Drilling Machine
Layout
Vertical
Controlling Mode
Artificial
Number of Shaft
Multi-Axis
Hole Diameter
<50mm
Automatic Grade
Automatic
Precision
High Precision
Certification
CE, RoHS, ISO 9001
Number of Laser Heads
4 Heads
Efficiency Boost
300% Higher Than Single-Head
Product Description

Advanced 4-Head Laser Drilling System: Cutting-Edge Technology for High-Speed PCB & Flexible Circuits

Laser Drilling System

Industry-first multi-head technology delivers a 4x efficiency boost with simultaneous operation. Supports roll-to-roll, roll-to-sheet, and sheet-to-sheet automation. Featuring ±0.02mm accuracy and nanosecond/picosecond UV/green laser options, it is ideal for PCB, battery separator, and flexible circuit applications.

Technical Highlights
🚀
Pioneering 4-Head Design:

Breaks the efficiency bottleneck of traditional single-head equipment, enabling "one feed, four outputs" for massive productivity gains.

Feature Advantages Business Benefit
4-Head Synchronous Four galvo scanners work simultaneously. 4X Efficiency Boost & faster delivery.
Processing Flexibility Handles Roll-to-Roll / Roll-to-Sheet / Sheet-to-sheet. Maximize ROI for multiple markets.
±0.02mm Precision High-resolution servo motors & CCD vision. Zero-Defect production & premium quality.
Picosecond UV Laser "Cold" ablation with extremely small HAZ. Superior hole quality without thermal damage.
Picosecond Laser Innovation
Process Optimization
Specifications
Laser TypeNanosecond UV, Picosecond UV, Picosecond green laser
Processing Area550mm × 1500mm (customized)
Machine Size7200mm × 2300mm × 2250mm
Accuracy±0.02mm
Electric PowerMain Unit +30kW Chiller +7kW Exhaust Fan +11kW
Machine Weight8000 KG
EnvironmentHumidity: 40% - 60%; Temperature: 22℃±2
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Research and Development

Specializing in the independent research and development of laser generators, optical devices, and automation system integration. Providing innovative solutions for laser micromachining in industries such as PCB, semiconductors, and new energy batteries.

R&D Team 1
R&D Team 2
R&D Team 3
Mechanical Design
Laser R&D
R&D Lab
Application Areas
💎
PCB & Semiconductor: HDI PCBs, Multi-layer Boards, IC Substrates, and Lead Frames.
🛠️
Flexible Electronics: FPC, Flex-Rigid Boards, and Polyimide cutting/drilling.
Applications
Packing & Delivery
Packing
1PCS / Wooden Case
Shipping
By sea (Recommended) or by International Express
Standard Lead Time
30-45 Days after deposit
Customized Lead Time
45-90 Days after deposit
Shipping
Frequently Asked Questions
What is the advantage of 4-head synchronous drilling?
Our 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time.
What is the processing accuracy?
The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes at high speeds.
What materials can it process?
It is compatible with FR4, rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.
Does it support blind vias and buried vias?
Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.
Is the system automated?
Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.
Is beam quality consistent across all 4 heads?
Our beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality.
Our Clients
Client Partners

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