Automated Four-Head Laser Drilling System: Seamless Roll-to-Roll & Sheet Processing for Electronics

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Automated Four-Head Laser Drilling System: Seamless Roll-to-Roll & Sheet Processing for Electronics

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Product Description

Basic Information

Structure	Laser Drilling Machine	Layout	Vertical
Controlling Mode	Artificial	Number of Shaft	Multi-Axis
Hole Diameter	<50mm	Automatic Grade	Automatic
Precision	High Precision	Certification	CE, RoHS, ISO 9001
Laser Type	Nanosecond UV, Picosecond UV, Picosecond Green Laser	Number of Laser Heads	4 Heads (Synchronous/Independent)
Key Innovation	Industry-First 4-Head Synchronous Technology	Efficiency Boost	300% Higher Output Than Single-Head

Product Description

Automated Four-Head Laser Drilling System: Seamless Roll-to-Roll & Sheet Processing for Electronics

Introducing the groundbreaking Four-Head Roll-to-Roll Laser Drilling Equipment - the industry's first solution designed to revolutionize high-volume electronics manufacturing. As a pioneer in multi-head laser drilling technology, this equipment delivers unprecedented 4x efficiency improvements while maintaining superior precision standards. Engineered for the most demanding production environments, this machine represents the future of automated electronics manufacturing, combining cutting-edge technology with proven reliability.

Product Highlights

🚀4-Head Synchronous Processing

Massive 4X Efficiency Boost: Dramatically increase output and meet tight deadlines for large orders.

⚡Optimized Process (Plasma-Free)

Laser parameters are fine-tuned to eliminate post-drilling plasma treatment, reducing process steps and consumables.

💎Picosecond UV Laser Source

Superior Hole Quality: No burrs, cracks, or thermal damage. Perfect for delicate materials like polyimide and glass.

Precision & Quality Assurance

Our Four-Head Laser Drilling Machine delivers exceptional precision with microscopic accuracy. Quality results on various materials including PCB, battery separator, and flexible circuit samples demonstrate perfectly round and uniform holes.

Efficiency Comparison

4x increase in production capacity
Significant reduction in production time
Lower operational costs per unit
Improved return on investment

Technical Specifications

Product Name	±0.02mm Precision Four-Head Laser Drilling Machine
Processing Area	550mm×1500mm (customized)
Machine Size	7200mm×2300mm×2250mm
Processing Accuracy	±0.02mm
Electric Power Loading	Main Unit + 30kW Chiller + 7kW Exhaust Fan + 11kW
Machine Weight	8000KG
Environment Requirements	Humidity: 40% - 60%; Temperature: 22℃±2

About the Manufacturer

Founded in 2013, it is a technology-oriented enterprise that specializes in the independent research and development of laser generators, optical devices, equipment application processes, and integration of automation systems. We provide innovative solutions for laser micromachining applications, including processing technology, laser sources, and optical systems for industries such as printed circuit boards, consumer electronics, semiconductors, glass, new energy, and solar energy.

Application Areas

PCB Industry
HDI PCBs, Multi-layer Boards, High-speed through-hole & blind via drilling.

Flexible Circuits
FPC, Flex-Rigid Boards, Polyimide cutting & drilling.

Semiconductor
IC Substrates, Lead Frames, Ultra-fine micro-vias (≤0.05mm).

Consumer Electronics
Smartphones, Wearables, Mass production solutions.

Packing & Delivery

📦Packing: 1PCS / Wooden Case

🚢Shipping Method: By sea or by express. Considering weight, sea shipping is recommended; international express is suitable for urgent needs.

⏱️Delivery Time: 30-45 days for standard goods; 45-90 days for customized goods after deposit confirmation.

Frequently Asked Questions

What is the advantage of 4-head synchronous laser drilling machine?

Our 4-head technology enables parallel processing, quadrupling throughput for HDI PCBs and Flexible Circuits (FPC) while significantly reducing cycle time.

What is the processing accuracy?

The system features a positioning accuracy of ±0.02mm and ±0.01mm repeatability, ensuring precise micro-vias and blind holes at high speeds.

What materials can it process?

Compatible with rigid PCBs, Flexible PCBs (FPC), polyimide, ceramic substrates, and copper clad laminates.

Does it support blind vias and buried vias?

Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.

Is the system automated?

Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.

Is beam quality consistent across all heads?

Our beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality across the entire processing area.