CXO Laser
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Pioneering Multi-Head Laser Drilling System
Revolutionary 4x Productivity Enhancement for High-Volume Electronics Production
In the fast-paced world of electronics manufacturing, speed, precision, and versatility are paramount. Our 4-Head Roll-to-Roll Laser Drilling Machine is engineered to meet these demands, delivering a 4x increase in throughput for high-volume production of HDI PCBs, FPCs, and other advanced materials. By integrating four independent high-precision laser heads with advanced roll-to-roll automation, this system provides a complete solution for boosting production capacity and reducing per-unit costs.
Unmatched Efficiency
4× higher output than single-head machines, cutting production time by 75%.
| Feature | Advantages | Business Benefit |
|---|---|---|
| 4-Head Synchronous Processing | Four galvo scanners work simultaneously on a single workpiece. | Massive 4X Efficiency Boost to meet tight deadlines. |
| Flexible Handling | Handles continuous rolls and individual sheets. | Maximize ROI serving diverse markets (HDI, FPC, PCB). |
| ±0.02mm Precision | High-resolution servo motors and CCD vision positioning. | Zero-Defect Production for next-gen electronics. |
| Picosecond UV Laser | “Cold” ablation process with extremely small HAZ. | Superior hole quality with no thermal damage. |
| Laser Type | Nanosecond UV, Picosecond UV, Picosecond green laser |
| Processing Area | 550mm × 1500mm (customized) |
| Machine Size | 7200mm × 2300mm × 2250mm |
| Accuracy | ±0.02mm |
| Machine Weight | 8000KG |
| Environment | Humidity: 40% - 60%; Temperature: 22℃±2 |
Founded in 2013, we specialize in the independent research and development of laser generators, optical devices, and automation system integration. We provide innovative solutions for laser micromachining across industries such as printed circuit boards, semiconductors, and new energy batteries.
